Fraunhofer Institute for Integrated Circuits IIS; International Audio Laboratories Erlangen; Fraunhofer Institute for Integrated Circuits IIS; Fraunhofer Institute for Integrated Circuits IIS
ONFUTURE Ltd, Tokyo 141-0032 Japan, and SONA Corporation, Tokyo 164-0013 Japan; Tokyo University of the Arts, Tokyo 120-0034 Japan; Kyushu University, Fukuoka 815-8540 Japan, and ONFUTURE Ltd, Tokyo 141-0032 Japan
Leppänen, Jussi; Politis, Archontis; Laitinen, Mikko-Ville; Pajunen, Lauros; Eronen, Antti
Nokia Technologies, Finland; Nokia Technologies, Finland; Nokia Technologies, Finland; Nokia Technologies, Finland; Audio Research Group, Tampere University, Finland
Paik, Seungryeol; Han, Jisu; Kim, Taehyeop; Lee, Kyogu
Department of Intelligence and Information, Seoul National University; Department of Music, Seoul National University; Dream Scape Inc.; Department of Intelligence and Information, Seoul National University, and Artificial Intelligence Institute, Seoul National University, and Interdisciplinary Program in Artificial Intelligence, Seoul National University
Daugintis, Rapolas; Alary, Benoît; Geronazzo, Michele; Picinali, Lorenzo
Audio Experience Design, Dyson School of Design Engineering, Imperial College London, UK; STMS, IRCAM, Sorbonne Université, CNRS, Ministère de la Culture Paris, France; Audio Experience Design, Dyson School of Design Engineering, Imperial College London, UK, and Department of Engineering and Management, University of Padova, Italy; Audio Experience Design, Dyson School of Design Engineering, Imperial College London, UK
