van de Par, Steven; Disch, Sascha; Niedermeier, Andreas; Burdiel Pérez, Elena; Edler, Bernd
University of Oldenburg, Oldenburg, Germany; Fraunhofer Institute for Integrated Circuits IIS, Erlangen, Germany; Friedrich Alexander University, Erlangen-Nürnberg, Germany; Fraunhofer HAS, Oldenburg, Germany
October 2019
Convention Paper
Free to AES members & instutions and $33 to non-members