AES

Organizer


AES

The Audio Engineering Society's mission is to promote the science and practice of audio by bringing leading people and ideas together.

AES

Organizer

AES

The Audio Engineering Society's mission is to promote the science and practice of audio by bringing leading people and ideas together.

DigiPen

Location

DigiPen
Redmond, Washington
Since 1988, DigiPen Institute of Technology has been preparing students to succeed as skilled engineers, artists, and designers in the growing technology industries.
Website
Link
DigiPen

Location

DigiPen
Redmond, Washington
Website
https://www.digipen.edu/about

Since 1988, DigiPen Institute of Technology has been preparing students to succeed as skilled engineers, artists, and designers in the growing technology industries.

Date

Aug 15 - 17 2022

Time

Pacific
All of the day

Status

Call for Submissions,
Sponsorship options

International Conference on Audio for Virtual and Augmented Reality

The Audio Engineering Society is pleased to announce its fourth International Conference on Audio for Virtual and Augmented Reality. This conference will gather research scientists, engineers, VR and AR developers and content providers to explore and discuss topics such as: spatial audio capture, rendering and synthesis over headphones and loudspeakers; binaural, ambisonics and wave field synthesis techniques; 3D sound field navigation; HRTF modeling and derivation from optical and/or acoustic measurements; reverb and room acoustics synthesis; 3D audio mixing and content production; and sound design for VR/AR, and best practices. The three-day conference program will focus around the dissemination of top-level research in the field of spatial audio for virtual and augmented reality, and discussion of technical solutions and recommended practices. In addition to the paper and poster sessions, the conference will also consist of invited presentations from key researchers, practitioners and industry leaders, demonstrations, panel discussions, tutorials, and workshops. Call for Submissions now open! Stay tuned for Registration information.

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